Replacing American chips with domestic chips is currently the mainstream, and in terms of server chips related to information security, another chip company in China has launched server chips. This time, it is truly a pure domestic chip, achieving localization in chip architecture and manufacturing, supplemented by chip stacking technology to improve chip performance and reach the level of mainstream server chips.
This company that releases pure domestic server chips is Godson. Godson 3D5000 packages two wafer level Godson 3C5000 together, thereby doubling the performance and fully meeting the performance requirements of server chips. This is another attempt by domestic chips in chip stacking technology, providing new ideas for domestic chips.
Chip stacking technology has long been proposed and attempted by domestic chips, but Loongson is the first among domestic chips to apply chip stacking technology commercially. The application of chip stacking technology on server chips can solve the problem of heat dissipation. Generally, servers have a large space, while the application of chip stacking technology on mobile phones takes into account the narrow space of mobile phones and requires addressing power consumption issues in order to be applied.
Using chip stacking technology to improve performance has been adopted by many chip enterprises outside Chinese Mainland, among which the M1 ultra launched by Apple is a stacking chip. M1 ultra connects two M1 chips together with a special connection technology to achieve twice the performance. TSMC also uses a similar way to package two 7nm chips together to improve the performance by 40%, which is better than 5nm chips.
Server chips are related to information security issues. China has been promoting domestic server chips to replace Intel's server chips. In recent years, domestic ARM architecture server chips have gained significant market share, and domestic server chips such as alpha architecture and X86 architecture have also gained some market share.
However, both ARM and X86 architectures are controlled by the United States, and ARM's latest requirements do not authorize the powerful Neoverse V series specifically developed for server chips to Chinese chip companies, further prompting domestic chips to develop server chips with controllable chip architectures.
The Loongarch chip architecture developed by Longxin itself is a completely self-developed chip architecture, which will not be affected by the United States. It not only ensures chip security, but also completely controls the upgrade of chip architecture, which has irreplaceable significance for the development of domestic server chips.
Nowadays, chip stacking technology has been applied in server chips, which means that the constraints of advanced technology on domestic server chips have been broken. This technology can be used to significantly improve the performance of server chips and meet the performance requirements of domestic data centers for server chips.
It can be said that the launch of the Godson 3D5000 will inspire more domestic chip companies to develop purely domestic server chips, replacing the server chips of American chip companies such as Intel with server chips designed and produced by domestic chip architectures and manufacturing processes. This will be a huge blow to the American chip industry, and domestic chips will further break free from the limitations of American technology